Design Guide For Protection of Printed Board Via Structures: Association Connecting Electronics Industries | PDF | Printed Circuit Board | Solder
Extracts from IPC 4761 (for additional manufacturing information please contact us at www.express-pcb.de )
Is there any possibility in The MRA that Cupper filled vias (IPC 4761 type VII) are not reported in " VIAS in SMD" " Hole in SMd "and "VIA to toeprint ".
Design Guide For Protection of Printed Board Via Structures: Association Connecting Electronics Industries | PDF | Printed Circuit Board | Solder
![英語版]IPC-4761: Design Guide for Protection of Printed Board Via Structures| IPC公式オンラインショップ ~製造業のためのグローバル品質標準・規格~ 英語版]IPC-4761: Design Guide for Protection of Printed Board Via Structures| IPC公式オンラインショップ ~製造業のためのグローバル品質標準・規格~](https://www.ipcstore.jp/images/item/9/images/02.jpg)